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How Will Printed Electronics Shape the Print & Packaging Industry?
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Come to Ryerson University for an evening of networking and education. Our speakers will be discussing the latest developments in printed electronics, how they will be incorporated into packaging workflows, and the marketing implications for the consumer packaging industry. A catered reception will follow featuring interactive product demonstrations from Bash Interactive, Ryerson DMZ startup Flybits, and Graphic Monthly Canada.

When:
Thursday, March 28th, 2013
6:00pm-6:30pm: Registration
6:30pm-7:00pm:
Latest Developments in Printed Electronics, Paul Smith (Xerox XRCC)
7:00pm-7:30pm:
Printed Electronics for Consumer Packaging, James Lee (Jones Packaging)
7:30pm-8:00pm:
Panel Discussion / Q&A
8:00pm-9:00pm:
Catered reception / Interactive Demos

Where:
Ryerson University
George Vari Computing & Engineering Building
245 Church St
Toronto, ON
M5B 1Z4
Room ENG103

Map of Ryerson Parking

Price:
FREE (DINNER INCLUDED)

How:
CLICK HERE TO REGISTER ONLINE

Contact for more information:
Andrew Wong
Ryerson University
416.843.6168
andrew2.wong@ryerson.ca

Lindsey Ogle
PAC – The Packaging Association
416.646.4641
logle@pac.ca

Speakers:
  Dr. Paul Smith
Vice President,
Xerox Innovation Group (XRCC)
Latest Developments in Printed Electronics



  James Lee
Director, Technology & Innovation,
Jones Packaging
Printed Electronics for Consumer Packaging




Interactive Product Demos From:


Bash! Interactive
Specializing in solutions for digital & interactive out-of-home marketing campaigns. Bash! will be showcasing their NFC Tap2 and RFID Connect technologies, and a few other surprises!


Flybits
What if smart phones could “sense” who we are, where we are and what was important to us? The Flybits platform delivers relevant, timely, location-based info to targeted mobile users.


Graphic Monthly Canada

Launched in 1980, Graphic Monthly Canada is Canada’s printing industry authority distinguished by editorial excellence, outstanding design and excellent circulation.


 Access the Global Packaging Network

 © 2013 PAC

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